Man, if someone ever invents a hot swapping chassis that works for spacecraft hardware, they're gonna really strike it rich.
Most radiation testing for total dose effects (which is at issue here, I think) is done with elemental radiation sources (e.g. Cesium 137 or Cobalt 60). I recall hearing numbers like “about $1/rad” for testing (So testing to 20 kRad is about $20k) The tricky thing is that the effects are different if it’s a high dose rate or a low dose rate. There are things like annealing (radiation damage heals itself, especially if the part is hot, the displacement in the lattice caused by a charged particle can “flow” back into place over time).high intensity radiation environments aren't the easiest things to emulate on the ground, you may have to buy some op time with a particle accelerator, which won't be as chaotic as the real thing
You're not buying enough to get a sales rep. $8 is a bit of an exaggeration. You're a few orders of magnitude too low for anyone to care. Once you do have the sales rep, then that rep will be concerned about that meager $8 purchase, because of the expectation that you're prototyping for something that will require thousands more units.Say what? I've placed orders at Digikey at least 50 times and I have never been asked about their application.
Also note that Starship is doing everything possible to remove connectors. Flanges are replaced with welds. Welds are replaced with integral manufacturing. Even when you have mass and volume to spare, everyone hates connectors.Even cold swapping would be nice. The challenge is that most missions are pushing their mass limit, and the extra hardware and volume to make swapping easy is something they can’t afford. Not to mention that “swap” implies connectors, and anyone who has worked with spacecraft hates connectors. Connectors are what fails, connectors are what cause problems with signal integrity, perhaps not quite as bad as valves, but they’re way up on the list, and most valves have connectors, for two reasons to hate valves.
This is, by the way, one of the big changes that launch vehicles like Starship will make - all of a sudden, you’re not trying to squeeze into a small fairing and remove every last gram of excess mass.
And if you think electrical connectors are bad, try optical ones. There's nothing quite like "oh crap, this single-mode fibre tip has a burned face where a speck of dust touched it, now let's go track down every other connector face that it could possibly have touched since the damage first occurred...."Also note that Starship is doing everything possible to remove connectors. Flanges are replaced with welds. Welds are replaced with integral manufacturing. Even when you have mass and volume to spare, everyone hates connectors.
In addition Io provides a large batch of particles to ionize and accelerate. You can even see the glowing footprint of Io in Hubble images of Jupiter's aurora.The radiation problem they are concerned with is mainly charged particles from the Solar Wind trapped in Jupiter's magnetic field. They whiz around and build up to a much higher level than they do just coming straight from the Sun.
I wouldn't expect optical connectors to be generally viable in space until they are made from explicitly covalently bonded materials. The optical interface is just too prone to material dislocations otherwise.And if you think electrical connectors are bad, try optical ones. There's nothing quite like "oh crap, this single-mode fibre tip has a burned face where a speck of dust touched it, now let's go track down every other connector face that it could possibly have touched since the damage first occurred...."
I agree with you. The problem is when you have SEU's ( Single Event Upsets) you basically create a carbon track in the Silicon of the chip which can interfere with the operation of transistors. A high energy particle can disrupt your memory. Nothing like a bit flip to put spacecraft in safe mode.
A high energy particle hitting a transistor is like applying a Defibrillator to a person with a normal pulse. The results are never good. The higher the density of transistors on a chip the more issues you are going to have and the more shielding they will need in high intensity radiation environments such as space exploration. Of course as long as we launch from the Earth weight will always be a limiting factor in all of our space exploration. In other words NASA needs a facility in Earth Orbit or on the Moon.
These are power transistors. I would expect they’re too large to be affected by SEUs.SEUs are only part of the problem.
Some types of radiation will physically damage transistors changing their characteristics.
And just to make it extra weird sometimes you get behaviours where transistors get worse and then get less worse depending as dose increases.
This is a dinosaur company, you are completely underestimating their strength. For example, you can recall the case when SpaceX sent its parts for military certification to a similar company in the USA. SpaceX discovered that the signatures on the certificates were too similar. After conducting investigations, they discovered that no action was being taken with the parts. The signature was simply copied and the parts were sent back. The company got away with it by simply throwing one person under the truck.It really doesn't even matter. They found a fault with the hardware. All purchasers of that hardware should have been notified, and it left up to the purchaser to determine whether they were affected or not.
That's definitely not true.Agree. Additionally I am pretty sure launching a part into interplanetary space does not legally count as the part being "exported", as it is never "imported" into another country.
Bulk silicon is also prone to 'latch up', and as a result, rad-hard dice frequently use different technologies for chip manufacture, e.g., SOS (Silicon On Sapphire) or SOSE (Silicon On Something Else), where a thin layer of silicon is grown or mounted on sapphire or some other thermal-expansion-matched substrate. The very thin layer of silicon also makes the bulk much smaller for the absorption of radiation and generation of charged ions and free electrons in the silicon itself.The package isn’t what makes them rad-hard. The hardness comes from how the doping and layers of the semiconductor are done. They’re hard (in theory) as bare dice.
Interesting, thank you.That's definitely not true.
A story from a friend who was at Caltech around 1970 about a mission to Venus: (from memory... which may be failing). A Venus mission used a gem-quality, sapphire lens, valued at a large value (US$20k?) that was imported from overseas to the U.S. The sapphire was integrated into probe, and prior to launch, someone from U.S. Customs was shown the lens in the probe, and commissioned to witness the launch, allowing him to check off the 'exported' box on a form, saving the probe assembler from paying import duties.
I'm sure somebody here can make a better guess than me as to which probe it was.
It's been stated the affected parts were made by Infineon.Any idea who the manufacturer of the FETs is?
MOSFETs actually make pretty good radiation detectors as the damage effects are predictable.SEUs are only part of the problem.
Some types of radiation will physically damage transistors changing their characteristics.
And just to make it extra weird sometimes you get behaviours where transistors get worse and then get less worse depending as dose increases.
I agree with the sentiment, but not the wording. To be exported, a product only needs to leave the country of manufacture. Space is not America, thus it should be an export according to my understanding.Agree. Additionally I am pretty sure launching a part into interplanetary space does not legally count as the part being "exported", as it is never "imported" into another country.
You're not buying enough to get a sales rep. $8 is a bit of an exaggeration. You're a few orders of magnitude too low for anyone to care. Once you do have the sales rep, then that rep will be concerned about that meager $8 purchase, because of the expectation that you're prototyping for something that will require thousands more units.
The “single event effect” (SEE, the generic term) that one worries about for MOSFETS is Single Event Gate Rupture (SEGR). Let’s say you’ve got a part with 100V Max Vgs - And for some reason, you’ve got 90V on the gate, and then a charged particle comes by at pushes the field at some location over the limit - bang, hole in the oxide film, and you’ve just got a failed FET.These are power transistors. I would expect they’re too large to be affected by SEUs.
You do not. Launching into space is not exporting. You retain ownership as well, so if it falls out of the sky and causes damage, you’re liable. It is the “launching nation” that is responsible for policing this.Interesting, thank you.
So exploiting a tax loophole by claiming "export" to save some money seems to have worked in the past. GG
I'd regard this as "loophole" as this still would be an export without a corresponding import and tax being paid elsewhere on import is the very reason this "exported" box exists in the first place.
As for the discussion's context of mandatory export regulation of space parts:
Can anybody confirm/deny that you need to run all parts send into interplanetary space or LEO through export regulations?
It doesn’t have to be lead - when it comes to shielding, it’s mostly “mass per area” that counts. Aluminum can be used, steel, tantalum, etc. If you know in advance, spot shielding of individual parts has been done.Would a lead enclosure for protecting the electronics (or even just the MOSFETs, depending on the case) be a possibility? Or the amount of lead necessary to protect it would be too much weight?
With SPENVIS, one can generate a spacecraft trajectory or a coordinate grid and then calculate:
Magnetic field line tracing is implemented, as well as the generation of world maps and altitude dependence plots of the magnetic field and the current models of the neutral atmosphere and the ionosphere.
- geomagnetic coordinates
- trapped proton and electron fluxes and solar proton fluences
- radiation doses (ionising and non-ionising) for simple geometries
- a sectoring analysis for dose calculations in more complex geometries
- damage equivalent fluences for Si, GaAs and multi-junction solar cells
- Geant4 Monte Carlo analysis for doses and pulse height rates in planar and spherical shields
- ion LET and flux spectra and single event upset rates
- trapped proton flux anisotropy
- atmospheric and ionospheric densities and temperatures
- atomic oxygen erosion depths
Models for spacecraft charging, both surface charging and internal charging, are available.
A tool to visualise satellite data produces panel plots of measured quantities in combination with geomagnetic and solar indices.
Micrometeoroid and space debris models are implemented, and an impact risk analysis module is currently under development.
Juno is using a titanium vault, with walls 1cm thick.It doesn’t have to be lead - when it comes to shielding, it’s mostly “mass per area” that counts. Aluminum can be used, steel, tantalum, etc. If you know in advance, spot shielding of individual parts has been done.
As I recall, for Europa’s surface environment, shielding equivalent to a meter or two of water (so, 100-200 g/cm2) is sufficient to shield down to “normal“ levels of radiation.
But there’s a problem - shielding works pretty well for total dose, but not as well for high energy particles. For one thing, when that high energy particle hits the shield and gets stopped, that generates a bunch of new radiation (X-rays, often) - bremsstrahlung (Literally “braking radiation” in German). That’s how X-ray tubes work - shoot 100 keV electrons at a copper target.
There are clever shielding designs of multiple materials that are more effective - first layer stops the incident particle, subsequent layers stop the secondary particles, etc.
The other problem is that there are really high energy particles for which it’s not possible to shied enough (Galactic Cosmic Rays) - they’re going to come on through.
If you want to fool around with radiation and shielding models, take a look at SPENVIS
https://www.spenvis.oma.be/intro.php
And for neutrons, you want light weight atoms - water, paraffin, etc. But of course neutrons would not get trapped in Jupiter’s magnetic field.It doesn’t have to be lead - when it comes to shielding, it’s mostly “mass per area” that counts. Aluminum can be used, steel, tantalum, etc. If you know in advance, spot shielding of individual parts has been done.
As I recall, for Europa’s surface environment, shielding equivalent to a meter or two of water (so, 100-200 g/cm2) is sufficient to shield down to “normal“ levels of radiation.
But there’s a problem - shielding works pretty well for total dose, but not as well for high energy particles. For one thing, when that high energy particle hits the shield and gets stopped, that generates a bunch of new radiation (X-rays, often) - bremsstrahlung (Literally “braking radiation” in German). That’s how X-ray tubes work - shoot 100 keV electrons at a copper target.
There are clever shielding designs of multiple materials that are more effective - first layer stops the incident particle, subsequent layers stop the secondary particles, etc.
The other problem is that there are really high energy particles for which it’s not possible to shied enough (Galactic Cosmic Rays) - they’re going to come on through.
If you want to fool around with radiation and shielding models, take a look at SPENVIS
https://www.spenvis.oma.be/intro.php
Right. Contact your other customers and briefly summarize the issue, and ask if they'd like to consult further with you on this. Communicate.That's gnarly. Infineon didn't consider that NASA might have used their radiation-hard components in a radiation-intensive environment?
This is such a child's "it wasn't my fault" response.There is some basic information missing from this article. The company which manufactured the transistors is Infineon.
From Science
"Some years ago, Infineon changed its manufacturing process for its radiation-hard MOSFETs, which it designs to meet U.S. military specifications—the same radiation-resistance standards used by the Clipper team. After this change, the company’s classified customers found that several lots of the transistors failed at lower than expected radiation levels, Fitzpatrick said. The company has already corrected the mistake, but Infineon did not report the flaw to NASA because the company did not know what the transistors would be used for, Fitzpatrick said. “They did not realize it was going to affect us.” Infineon did not respond to a request for comment."
Strictly speaking, GCR can be shielded against, but it takes about a mile of HRE (hard rock equivalent) to do it. Neutrino detectors are located deep in old mines for that reason. That obviously isn't practical for spacecraft.It doesn’t have to be lead - when it comes to shielding, it’s mostly “mass per area” that counts. Aluminum can be used, steel, tantalum, etc. If you know in advance, spot shielding of individual parts has been done.
As I recall, for Europa’s surface environment, shielding equivalent to a meter or two of water (so, 100-200 g/cm2) is sufficient to shield down to “normal“ levels of radiation.
But there’s a problem - shielding works pretty well for total dose, but not as well for high energy particles. For one thing, when that high energy particle hits the shield and gets stopped, that generates a bunch of new radiation (X-rays, often) - bremsstrahlung (Literally “braking radiation” in German). That’s how X-ray tubes work - shoot 100 keV electrons at a copper target.
There are clever shielding designs of multiple materials that are more effective - first layer stops the incident particle, subsequent layers stop the secondary particles, etc.
The other problem is that there are really high energy particles for which it’s not possible to shied enough (Galactic Cosmic Rays) - they’re going to come on through.
If you want to fool around with radiation and shielding models, take a look at SPENVIS
https://www.spenvis.oma.be/intro.php
There is an old lawyer/cockroach joke here I am not going to repeat, but to say cockroaches were reportedly to have a high radiation tolerance.“Hey boss, any lawyers likely to be around after a nuclear war?”
“Probably not. How’s that testing going?”
“Oh, no problems we need to worry about!”
The package isn’t what makes them rad-hard. The hardness comes from how the doping and layers of the semiconductor are done. They’re hard (in theory) as bare dice.
I'll disagree with you: without the appropriate process(es) and feature size(s) and technologies, dice won't be rad-hard. Depending on the application, the packaging may also matter a great deal. E.g., packaging may be critical for resistance to alpha particles (not penetrating) or itself cause problems (thorium in the packaging, as happened a few decades back), or may make problems worse due to creation of secondary particles, depending on the expected environment.I would humbly disagree with you on this one
Having conducted such tests informally, yes, cockroaches are pretty radiation tolerant. They are also vacuum tolerant. And plasma etcher tolerant. When your bosses buy surplus equipment, as you’re cleaning it up and making sure it works, you can have all sorts of fun.There is an old lawyer/cockroach joke here I am not going to repeat, but to say cockroaches were reportedly to have a high radiation tolerance.
if you are talking about the one that did fairing work for SpaceX for a while, no SpaceX brought that fully in house afterwards.This is a dinosaur company, you are completely underestimating their strength. For example, you can recall the case when SpaceX sent its parts for military certification to a similar company in the USA. SpaceX discovered that the signatures on the certificates were too similar. After conducting investigations, they discovered that no action was being taken with the parts. The signature was simply copied and the parts were sent back. The company got away with it by simply throwing one person under the truck.
for low intensity you can use elemental sources, high intensity, stuff that can cause latch ups and bit flips, you need a particle accelerator those tend to be booked up several years out.How difficult is it to set up a test environment, exposing semiconductors to radiation?
I would have thought that NASA would have done such testing, rather than completely rely on manufacturer specs.
NASA does do some radiation testing (typically of parts that don’t have a radiation pedigree), and they do proton testing of assemblies going to ISS (things like COTS routers, etc.). There used to be papers at MAPLD (may still be, I haven’t looked) every year with lists of all the stuff that got tested.How difficult is it to set up a test environment, exposing semiconductors to radiation?
I would have thought that NASA would have done such testing, rather than completely rely on manufacturer specs.
its also one of the things that x-37 is likely used for, especially with the FH launch.NASA does do some radiation testing (typically of parts that don’t have a radiation pedigree), and they do proton testing of assemblies going to ISS (things like COTS routers, etc.). There used to be papers at MAPLD (may still be, I haven’t looked) every year with lists of all the stuff that got tested.
(https://www.seemapld.org/ )Check out the archive of all the papers..
But for the most part, rad hard components are “designed” to be hard, and the mfr tests them in accordance with a variety of standard test procedures. The mfr often contracts that out to places that do such testing (e.g. TAMU or Brookhaven for accelerator testing). But, in general, DoD, NASA, and others wanting higher quality or rad-hard parts rely on checking the paperwork, rather than retesting. - one joke is that the QML and regular parts come off the same line, but the extra cost for the QML parts is the pallet of paperwork that’s delivered with the tube of parts.
Once the parts are tested, if the fab process doesn’t change, they would just do some sample testing from each lot, to make sure that nothing wonky is going on. Back in the day, there was significant change lot to lot, because processes weren’t as well controlled. Now, though, semiconductor processes are very, very well controlled.
Not back in the 70s when these were built. CA was CA, with maybe one or two variants. Nowadays? I'd think it likely.I'm surprised they would use CA glue anywhere near the optics, it's notorious for offgassing and covering surfaces with hazy residue while curing. Maybe there's some super expensive low off-gassing specialized formulation that I just haven't heard of.
There is a potentially missed opportunity here. Don't implant the transistors to begin with and let the Jovian radiation do that for you. Could end up with some novel new transistor types as well."replace the transistors" is a tremendous understatement. Might as well say "rebuild every PCB from scratch". It'd be easier, and cheaper.

I'll disagree with you: without the appropriate process(es) and feature size(s) and technologies, dice won't be rad-hard. Depending on the application, the packaging may also matter a great deal. E.g., packaging may be critical for resistance to alpha particles (not penetrating) or itself cause problems (thorium in the packaging, as happened a few decades back), or may make problems worse due to creation of secondary particles, depending on the expected environment.